The new favorite of LED display: MIP packaging technology, creating the ultimate visual feast!

In this era of rapid technological change, new technologies are quietly born every minute and every second. LED display, as an indispensable part of our daily life, shows its charm everywhere from outdoor billboards to home theaters to concerts. But do you know? As people's requirements for picture quality, brightness and durability are getting higher and higher, traditional LED display packaging technology has been difficult to meet these high standards. As a result, a technology called MIP (Mini LED In Package, micro LED packaging) came into being. It is like putting on a "super suit" for LED display, making the display effect even better!

MIP packaging technology, full name Mini/Micro LED in Package, is an advanced LED packaging technology that combines the high performance of Mini/Micro LED chips with the precision of packaging technology, bringing revolutionary changes to LED displays. The principle of MIP packaging technology will be explained in detail below:

Principle of MIP packaging technology

1. Chip mass transfer

The first step of MIP packaging technology is to transfer the Micro LED chip to the substrate through mass transfer technology. Mass transfer technology is a high-precision process that can transfer a large number of tiny LED chips from the growth substrate to another substrate (such as a PCB board) and maintain a high yield and precise position control of the chip. This step is the basis for achieving a high-density LED array.

2. Chip packaging

After the transfer is completed, the Micro LED chip is packaged on the substrate. The packaging process includes using conductive or non-conductive glue to adhere the chip and wire bonding to achieve electrical connection. The packaging material not only protects the chip from the external environment, but also provides good heat dissipation performance to ensure the stable operation of the LED chip.

3. Cutting into small packages

The packaged large-area LED array is cut into multiple small packages. These small packages can be single LED chips or small modules composed of multiple LED chips. The cutting process requires high-precision equipment and technology to ensure that the size and shape of each small package meet the design requirements.

4. Beam splitting and light mixing

The cut small packages need to be processed by beam splitting and light mixing. This step ensures the color uniformity and consistency of the entire display screen by precisely controlling the light emitted by each LED chip. Beam splitting and light mixing technology is one of the keys to achieving high-quality display screens.

5. SMT process and screen surface coating

Finally, the small package that has been processed by light splitting and light mixing is mounted on the back panel of the display screen, and the display screen is completed by the screen surface coating process. The SMT process requires high-precision equipment and technology to ensure the accurate position and flatness of each small package. The screen surface coating provides additional protection and aesthetic effects.

MIP packaging technology achieves high performance and high quality of LED display screens through a series of precise steps such as chip mass transfer, packaging, cutting, light splitting and light mixing, SMT process and screen surface coating. The emergence of this technology has injected new vitality into the development of the LED display industry.

What are the advantages and disadvantages of MIP packaging?

MIP packaging technology, namely Mini/Micro LED in Package, as an innovative LED packaging technology, has significant advantages and certain disadvantages. The following is a detailed analysis:

1. Advantages of MIP packaging technology

⑴Excellent display effect

MIP packaging technology can realize the comprehensive measurement of Micro RGB pixels, and the light splitting card ratio is accurate and meticulous, so that the LED lamp beads perform excellently in brightness, contrast and color consistency at different viewing angles. This technology can significantly improve the picture quality of the display screen and bring users a more realistic visual experience.

⑵ Low maintenance requirements

MIP packaging technology allows the LED screen to be removed and replaced separately when a broken lamp bead is detected without affecting other parts of the screen. This greatly simplifies maintenance work and reduces maintenance costs. In addition, MIP packaging technology also has good dust, moisture and anti-static properties, which improves the stability and reliability of the equipment.

⑶ High cost-effectiveness

MIP packaging technology can achieve mass production and reduce wafer costs. At the same time, it can also effectively reduce the defective screening rate and reduce downstream rework costs. In addition, MIP packaging technology is compatible with existing equipment, avoiding the cost of purchasing new equipment and R&D investment. This makes MIP packaging technology have significant advantages in cost control.

⑷ Flexibility and compatibility

MIP packaging technology can reuse SMD production equipment and reduce heavy asset investment. At the same time, MIP packaging products can adapt to the needs of different dot pitches and have high flexibility. In addition, MIP packaging technology also has good compatibility and can meet application requirements in different scenarios.

⑸Excellent heat dissipation performance

MIP packaged LED modules have better heat dissipation performance, which helps to reduce power consumption and temperature rise. This is of great significance for improving the stability of the equipment and extending its service life.

2. Disadvantages of MIP packaging technology

⑴Technology maturity

Although MIP packaging technology has many advantages, its technology maturity may still need to be improved compared with traditional packaging technology. This includes technical challenges in mass transfer, light separation and color separation, which require continuous research and development and optimization.

⑵Market acceptance

As an emerging technology, MIP packaging technology may still need some time to improve its market acceptance. Users may need more time to understand and recognize the advantages and application value of this technology.

⑶Cost competition

In some high-end application scenarios, the cost advantage of MIP packaging technology may not be obvious. Compared with mature packaging technologies, MIP packaging technology needs to make more efforts to reduce costs and improve cost performance.

⑷Application scenario limitations

Although MIP packaging technology has significant advantages in the field of small pitch and micro pitch LED display, it may still face certain challenges in some specific application scenarios. For example, in situations where extremely high pixel density or special optical effects are required, MIP packaging technology may need to be combined with other technologies to meet the needs.

MIP packaging technology has many advantages, but it also has certain disadvantages. With the continuous development of technology and the continuous expansion of the market, MIP packaging technology is expected to play a more important role in the field of LED display.

Which models of LED display screens use MIP packaging technology?

At present, some high-end LED display products on the market have begun to use MIP packaging technology, such as 4K and 8K ultra-high-definition display screens of some well-known brands, as well as professional-grade display screens customized for large-scale events and high-end conferences. With the maturity of technology and the reduction of costs, MIP packaging technology will become more popular in the future.

At present, multiple models of LED display screens have adopted MIP packaging technology. The following are some specific examples:

1. Micro LED new product with MiP technology

MiP0404 has been mass-produced and shipped in tape and reel form. Each MiP can be tested for spectral analysis to achieve display consistency. New generation Micro LED 8K (P0.6) ultra-high-definition display products: using Micro LED chips, flip-chip technology and MiP wire-free packaging process to achieve mass transfer of light-emitting chips.

2. MIP full flip-chip RGB 0.7/1.2/1.5 display products

MIP full flip-chip RGB 0.7/1.2/1.5 display products, integrating EBL+, somatosensory cold screen, DCI-P3 movie-level color gamut, picture quality engine and other technologies, fully support the needs of indoor and semi-outdoor application scenarios such as sports, commerce, cultural tourism, exhibitions, etc.

3. MiP packaging series products of MC1010, MC0606, and MC0404

The products can cover the dot pitch from P0.5 to P1.25. MiP products use needle puncture + laser welding technology, semiconductor carrier-level substrate, high chip transfer accuracy, more uniform product display, and can be arbitrarily arranged and combined into modules with strong versatility.

4. New MiP small pitch new product Q0.9 Pro

The new MiP small pitch new product Q0.9 Pro, with its excellent performance and outstanding design, has attracted many eyes as soon as it came out. The product adopts a delicate appearance design, thin frame and smooth lines, which not only shows the beauty of modern technology, but also facilitates installation and disassembly. In terms of size, the dot pitch of Q0.9 Pro is 0.9mm, which means that it can present a more delicate and clear picture effect. At the same time, its reasonable weight design not only ensures the stability of the product, but also facilitates transportation and installation.

It should be noted that with the continuous development of technology and changes in market demand, the models of LED display screens using MIP packaging technology are also constantly updated and increased. Therefore, when choosing an LED display screen, it is recommended to make comprehensive considerations based on specific application scenarios, display effects, maintenance requirements and cost budgets. At the same time, you can also pay attention to the latest developments and technology trends in the industry to obtain more information about MIP packaging technology and its applications.

What are the application scenarios of MIP packaging technology?

As an advanced LED packaging technology, MIP packaging technology has high density, high resolution, good heat dissipation performance and a wide range of application scenarios. The following are the main application scenarios of MIP packaging technology:

1. Commercial display

MIP packaging technology has a wide range of applications in the field of commercial display due to its excellent display effect. Whether it is a high-end shopping mall, luxury store or exhibition venue, the LED display screen with MIP packaging technology can provide delicate and realistic pictures, attract customers' attention, enhance brand image and improve product display effect.. These displays can play high-definition videos, dynamic advertisements and other content, adding a sense of modernity and technology to commercial spaces.

2. Virtual shooting

With the rise of XR (extended reality) technology, virtual shooting has become a new trend in the field of film and television production. LED display screens with MIP packaging technology have become an ideal choice for virtual shooting scenes due to their high brightness, high contrast, and wide color gamut. They can simulate real outdoor environments or specific scenes, provide actors with immersive performance space, and reduce post-production costs and time.

3. Consumer field

In the consumer field, LED display screens with MIP packaging technology also show great potential. From home theaters to gaming entertainment, MIP packaging technology can provide an excellent visual experience. For example, in home theaters, LED displays with MIP packaging technology can present more delicate and realistic images, making the audience feel as if they are in a movie scene; in terms of game entertainment, high-resolution, high-refresh-rate MIP packaging displays can bring a smoother, delay-free gaming experience.

4. Professional application fields

In addition to the above fields, MIP packaging technology also plays an important role in some professional application fields. For example, in the fields of medical imaging display, security monitoring, aerospace, etc., LED displays with MIP packaging technology can provide clearer and more accurate image information due to their high brightness, high contrast, high resolution and other characteristics, providing professionals with more reliable decision-making basis.

5. Outdoor advertising

Outdoor advertising is another important application scenario of MIP packaging technology. In outdoor environments with direct sunlight, the high brightness and weather resistance of MIP packaging technology can ensure that advertising information is clearly visible and is not affected by environmental factors. This is of great significance for enhancing brand image and attracting potential customers.

6. High-end conferences and events

LED displays with MIP packaging technology can also play an important role in high-end conferences, concerts, sports events and other activities. They can display conference content, performance images or live games in real time, providing the audience with an immersive viewing experience. At the same time, the LED display screen with MIP packaging technology is also flexible and customizable, and can be designed and adjusted according to the needs of different activities.

MIP packaging technology is gradually becoming one of the mainstream technologies in the LED display industry with its excellent performance and wide application scenarios. With the continuous maturity of technology and further reduction of costs, the market prospects of MIP packaging technology will be broader.

Future prospects of MIP packaging technology

According to publicly released information, the current market share of MIP packaging technology is about 0.5%. This data shows that although MIP packaging technology has significant technical advantages and application potential in the field of LED display, it is still in the early stages of market development and has a relatively low market share.

However, it is worth noting that the market growth trend of MIP packaging technology is very significant. With the continuous maturity of technology and the expansion of mass production scale, MIP packaging technology is rapidly heating up.

Incomplete data show that the MIP LED direct display product model increased by more than 10 times year-on-year in the spring of 2024. Many companies have increased their investment in MIP packaging technology, invested in the construction of multiple MIP production lines, and launched MIP packaging products. This shows that MIP packaging technology is gradually gaining market recognition and acceptance, and its market share is expected to grow rapidly in the next few years.

In terms of market competition, MIP packaging technology faces competitive pressure from other packaging technologies (such as SMD, COB, etc.). However, MIP packaging technology is gradually gaining market favor with its advantages such as high black ratio, special optical design, strong compatibility and strong applicability. At the same time, with the continuous expansion of the Micro LED market and the continuous advancement of technology, MIP packaging technology is expected to become one of the mainstream choices in the field of Micro LED packaging in the future.

1. Technological progress and cost reduction

With the continuous maturity of MIP packaging technology and the expansion of mass production scale, its production cost is expected to be further reduced. At the same time, technological progress will promote the continuous improvement of MIP packaging technology in performance to meet the needs of more application scenarios.

2. Market demand growth

With the increasing demand of consumers for high-quality display products and the rapid development of emerging technologies such as XR and Metaverse, the market demand for MIP packaging technology will continue to grow. This will provide a broad market space for the development of MIP packaging technology.

3. Collaborative development of the industrial chain

The development of MIP packaging technology is inseparable from the collaborative support of the industrial chain. In the future, with the close cooperation and joint promotion of upstream and downstream enterprises, MIP packaging technology is expected to achieve application breakthroughs in more fields and promote the upgrading and development of the entire LED display industry.

4. Policy support and standard formulation

Government policy support and the formulation of industry standards will also provide strong guarantees for the development of MIP packaging technology. With the introduction of relevant policies and the continuous improvement of standards, MIP packaging technology is expected to be promoted and applied in more fields.

MIP packaging technology, as an important innovation in the field of LED display screens, not only greatly improves the picture quality, brightness and durability of the display screen, but also brings us a more colorful visual enjoyment. With the continuous advancement of technology and the expansion of applications, I believe that in the near future, MIP packaging technology will become the mainstream of the LED display screen market, making our world more exciting because of technology!

Shenzhen Shinerave is a leading domestic supplier of LED displays.